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CategoriesDemo Equipment EVG®620 Double Side Mask AlignerEVG®620 Double Side Mask AlignerFor wafer size up to 100mm, Bond alignment optional Status: Demo Equipment Exposure modes: hard-, soft- and vacuum contact, proximity Separation distance 0-300 µm adjustable via software Wafer thickness 0.1 - 10 mm (top side aligner only) Semi automatic loading with mechanical prealignment on chuck Quick change of mask and chuck 15" flat screen for operator interface and alignment functions. ETL listing mark, conforms to UL STD 61010A-1 Table top configuration requires vibration isolated working desk provided by customer - optional: EVG AVT, EVG rack for aligner Please download the datasheet for technical details For general information on our EVG®620 Automated Mask Alignment System please visit the product page on the main EVG website: EVG®620 Automated Mask Alignment SystemDelivery time: On request 
AVAILABLE
Standard delivery time: 8 week(s)
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