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Categories Aligner Special Offer EVG®6200∞ Infinity – up to 200mm EVG®6200∞ Infinity – up to 200mmThe production tool for wafers up to 200mm. Optimized for highest throughput. 
EVG6200∞ Infinity Top Side Mask Aligner
For wafer size up to 200mm, Bond alignment optional
Nr. EVG6200T 
AVAILABLE
Standard delivery time: 13 week(s)
EVG6200∞ Infinity Double Side Mask Aligner
For wafer size up to 200mm, Bond alignment optional
Nr. EVG6200TB
AVAILABLE
Standard delivery time: 13 week(s)
EVG6200∞ Infinity Automated Double Side Mask Aligner
For wafer size up to 200mm, Bond alignment optional
Nr. EVG6200TBR
AVAILABLE
Standard delivery time: 17 week(s)
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