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Categories Aligner Special Offer EVG®620 – up to 150mm EVG®620 – up to 150mmHighest flexibility for optical double-side lithography and backside alignment up to 150 mm. 
EVG620 Top Side Mask Aligner
For wafer size up to 150mm, Bond alignment optional
Nr. EVG620T 
AVAILABLE
Standard delivery time: 13 week(s)
EVG620 Double Side Mask Aligner
For wafer size up to 150mm, Bond alignment optional
Nr. EVG620TB
AVAILABLE
Standard delivery time: 13 week(s)
EVG620 Automated Double Side Mask Aligner
For wafer size up to 150mm, Bond alignment optional
Nr. EVG620TBR
AVAILABLE
Standard delivery time: 17 week(s)
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